Visualisation
 Dedicated non destructive imaging and analysis of structures inside any bulk specimen
3D reconstruction
Display of mechanical properties of sample (hardness, density, stress, etc.)
Time of flight measurement
(A-scan)
Cross-section images (B-scan)
XY images: C-scan, D-scan, autoscan, multiscan |
Quantification
Fault statistics
Histogram analysis
Integrated measurement functions
Film thickness measurement
Multifunctional image processing
Time of flight measurements
Non-destructive depth measurement
Digital signal analysis
Phase measurements
Defect maps including result files |
Automation
Automatic X-Y-Z-scan and storage of all instrument parameters
Automatic fault recognition
Autofocus-system
Remote control
Fast auto sample detection
Auto gate and gain control
Auto signal analysis
Auto loader system integration
SECS interface
Integration of bar code readers
Auto alignment
High speed robot for wafer up to 12 inch including cassette load stations
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