Industrial application
Semiconductor application
Life science application
Micro cracks in the buffer
layer of a ball bearing.
Delamination inside the die-structure of an integrated circuit. Acoustic image of the interface area between enamel and dentine of a human tooth.
Grain structure
of an AlMg-alloy. 		Acoustic image of bumps
on a flip-chipstructure.		 Acoustic image of a
cortical bone structure.
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